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Microelectronics Packaging & Integration Symposium 2027

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Microelectronics Packaging & Integration Symposium Millbrae 2027
从 2027年2月9日 开始，直到2027年2月11日。
At Millbrae - The Westin San Francisco Airport Hotel, California, United States ( 显示地图)
请在参加之前，再次确认下方主办方所给出的日期和地点是否正确。
 https://smta.org/mpage/wafer
类别：工程行业, 包装行业
标签：包装, 半导体, 研讨会

The Microelectronics Packaging & Integration Symposium is SMTA's flagship conference on advanced semiconductor packaging. Formerly the Wafer-Level Packaging Symposium, the event reflects the industry's shift toward wafer- and panel-level processes, 3D integration, heterogeneous assembly, advanced manufacturing, test, and metrology. The symposium brings together engineers, researchers, and suppliers to share technical sessions, keynotes, exhibition space, and professional development courses focused on packaging challenges driven by AI, HPC, and complex system designs. The 2027 edition is scheduled at The Westin San Francisco Airport in the San Francisco Bay Area, California.

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Please register at the organizer website of Microelectronics Packaging & Integration Symposium

会场地图及周边酒店信息

Millbrae - The Westin San Francisco Airport Hotel, California, United States